Galaxy Z Flip 7: Exynos 2500 and Hinge Details
Recent reports suggest a significant development regarding the upcoming Samsung Galaxy Z Flip 7's processor. While the device is expected to feature Samsung's in-house Exynos 2500 SoC in many markets, including India and South Korea, a different chip may power the phone in other regions. The Snapdragon 8 Elite, the same flagship Qualcomm processor found in the Galaxy S25 series, is rumored to be the alternative for the US, Canada, and China. This strategy mirrors Samsung's previous approach with its Galaxy S series, offering different processors depending on the geographical region.
Hinge Technology Remains Unchanged
Rumors surrounding potential hinge upgrades for Samsung's next-generation foldable phones have also surfaced. While reports indicate a possible adoption of a titanium hinge for the Galaxy Z Fold 7 and a potential tri-fold device, there's currently no suggestion of such an upgrade for the Galaxy Z Flip 7. The device is therefore expected to retain the same hinge technology as its predecessor, the Z Flip 6.
Exynos 2500: Production Challenges and Performance Expectations
The Exynos 2500 has faced reported production challenges, with earlier rumors suggesting significant yield issues that could impact its availability. Despite these initial concerns, the chip is still slated to be featured in the Galaxy Z Flip 7 in several markets. The processor is also anticipated to offer a considerable performance increase over previous iterations. It is rumored to boast a 10-core structure, including a powerful Cortex X-5 CPU potentially clocked at 3.2 to 3.3GHz, accompanied by Cortex-A725 and Cortex-A520 cores. This promises a notable enhancement in processing capabilities.
Both the Galaxy Z Flip 7 and Z Fold 7 are anticipated to launch during Samsung's summer Unpacked event.
Source: Android Central